Global semiconductor foundry United Microelectronics Corporation (UMC) (NYSE:UMC) (TWSE:2303) announced on Thursday the release of its 14nm embedded high-voltage (eHV) FinFET platform for display driver ICs, with the process design kit now available to customers.

Validated at the company's Fab 12A facility, the platform is designed to improve power efficiency and performance while reducing chip size for next-generation smartphone displays.

Compared with UMC's existing 22nm display driver IC process, the 14nm platform delivers up to a 40% reduction in power consumption and a 35% reduction in chip area. The technology is intended to support longer battery life and thinner driver modules in premium smartphones.

UMC said the use of FinFET devices in digital circuitry improves electrical performance through optimised I/O devices and higher drive speeds, supporting higher refresh rates and signal integrity for high-resolution displays. The platform also includes enhanced mid-voltage device capabilities with tighter layout pitch and a broader voltage range to provide greater flexibility in source driver circuit design.